Taking our Laser Show on the Road at CPCA 2019

CPCA 2019
National Exhibition and Convention Center (Shanghai)
March 19 – 21, 2019

The lasers are in the crates, the photons locked in their chambers, and the goggles safely packed for CPCA 2019.   ESI is excited to be one of the over 500 exhibitors heading to the 28th CPCA exhibition. Our product managers, engineers and sales team are looking forward to engaging with 50,000 PCB professionals and helping manufacturers find the right system for their specific challenge.  

 

Get a Look at the New Capstone™

 

ESI will have a Capstone system in the booth so you can take a look at the system that is delivering the fastest blind via processing times in the industry. Discover how you can increase throughput up to 2X! Reduce overall processing costs by up to 30%

HDI Via Drilling Solutions

Please stop by the booth to speak with our HDI product team and learn the benefits of ESI’s new Geode CO2 System.   Discover six new technology features for HDI, SLP and ICP applications.

See you at CPCA 2019!

If you are looking to expand your capacity or increase your capabilities in Flex or Rigid PCB processing visit the ESI at booth 7R16 and discover which of our systems will meet your production challenges.