Sights from HKPCA 2018
ESI's photon playground is laser-focused on showcasing world-class via drilling solutions
The power of the photon is on full display at ESI's booth during the 2018 HKPCA show. Highlighted by the unveiling of the GeodeTM system, ESI's latest HDI drilling solution. The Geode system's unique architecture and features like HyperSonix deliver dramatically increased throughput with the accuracy and flexibility required for advanced 5G applications in a smaller, lighter package. You can find the Geode system on display in ESI's booth (1Q01) and have the opportunity to ask questions from our product managers, engineers, and sales team.
Beyond our HDI solutions, you will find the latest information around our market leading Flexible PCB solutions including our newly released Capstone system which can increase throughput by 2X and reduce overall processing costs by 30%.
The GeodeTM system
Show attendees take notice of the Geode's smaller footprint than other HDI laser systems based on legacy mechanical drilling platforms.
Discover ESI's complete HDI/ICP CO2 Drilling Solutions
Show attendees are meeting with ESI product experts to understand how ESI's latest features including HyperSonixTM provides HDI manufacturers the opportunity to achieve breakthrough levels of productivity and yield.
ESI's market-leading FLEX PCB Solutions
FPC processors interested in processing a range of materials at higher yields and higher productivity visited with our product managers and engineers discovering how they can put the CapStone to work to meet their production goals.
If you are attending HKPCA stop by our booth and meet the ESI team. We would love to talk about lasers and PCB solutions. If you are not at the show and have questions on our solutions drop us a note and we will get right back to you.
Long Live the Photon!