Laser Seeding for the Preparation of Conductive Features on Glass Substrates
“A novel process for the preparation of conductive features on glass substrates is presented. In this process, an ultrafast green laser is utilized to remove material from a transparent glass substrate, and a second laser source deposits Cu droplets through the laser-induced forward transfer of a donor film into the laser-etched features. Electroless plating methods that employ the laser-deposited Cu droplets as autocatalytic sites for plating (i.e., “seeds”) are then used to fill in the laser-etched features. Using this method, we have prepared functional printed circuit boards and transparent wire meshes on glass substrates.”
