First Cell Phone
It started on April 3, 1973, with Martin Cooper, a Motorola employee, on a bustling corner of New York City. A quick hello to a fellow researcher and key rival in creating the first cell phone.
Laser Direct Drilling
Drilling process where the top Cu is removed by chemical etching or UV Laser. The aperture is then used as a mask for CO2 drilling into the dielectric material.Discover its process limitations,
Non Clad
Dielectric materials for semi-additive and additive plating processes, typically for IC substrates. Discover its process limitations, advantages and how the Geode CO2 Laser Via Drilling
Karthik Ravi Product Marketing MLCC
The MKS|ESI team is excited to introduce you to our new product marketing leader within our MLCC team, Karthik Ravi.
Conformal Mask (1)
Drilling process where the top Cu is removed by chemical etching or UV Laser. The aperture is then used as a mask for CO2 drilling into the dielectric material.Discover its process limitations,
Beyond the Photon - Engineering Innovation
In this innovation episode of Beyond the Photon, we got the opportunity to sit down with Flex Engineering Senior Manager Joe Hasty.
Accelerate Material Processing Innovations
With 40 years of leadership in laser material interaction technology and via drilling precision, we can partner with you to process the latest material and PCB designs for future 5G and miniaturization market trends. Find two material posters below
MKS Instruments Sees Strong Adoption of its ESI® RedStone XP™ PCB Processing Systems
한국 및 기타 신흥 시장의 고객들은 ESI RedStone XP를 통해 PCB 용 레이저드릴 캐파를 지속적으로 확장하고 있습니다.
ESI CapStone system recieves Innovators Award.
“On behalf of the Laser Focus World Innovators Awards, I would like to congratulate MKS Instruments on their Gold level honoree status,” said Laser Focus World Publisher Paul Andrews. “This competitive program allows Laser Focus World to celebrate and recognize the most innovative products impacting the photonics community this year.”
Stepping Up to Laser Processing for Flex: Chapter 5
Learn the latest tips and tricks for developing effective flexible circuit laser processes.
Geode Expands HDI Footprint
[PRESS RELEASE] PORTLAND, Ore. – July 20, 2021 – MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of technologies that enable advanced processes and improve productivity, today announced confirmation of an order for the ESI® Geode™ HDI via drilling system from TTM Technologies, Inc. (“TTM”), a major technology leader in the HDI PCB manufacturing market, for their facility in Guangzhou, China. The financial terms of the order were not disclosed.
Stepping Up to Laser Processing for Flex: Chapter 4
Now it is time to get your new system installed and processing those first runs!
For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.
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