Understanding our customers' requirements.
ESI understands the challenges our via drilling customers face in production. We have a history of over 40 years of laser-material interaction experience. That experience, combined with our specific via drilling application expertise, makes ESI uniquely qualified to provide solutions that effectively address our customers’ production requirements and optimize their PCB manufacturing capabilities.
Flex Via Drilling Applications
Nine of the world’s top 10 flexible circuit manufacturers trust ESI with their bare board production. Our flex PCB laser processing systems excel in accuracy, power control, reliability, and productivity for applications ranging from the most simple coverlay cutting to today’s most advanced microvia drilling and circuit patterning processes.
- Flex Interconnect Processing
- Circuit Patterning
Integrated Circuit Packaging Applications
Evolving market needs are forcing leading-edge IC package fabricators to meet the increased throughput and accuracy requirements driven by the push to smaller devices. CornerStone delivers the productivity required for current HVM environments without sacrificing quality or accuracy.
nViant provides a CO2-based microvia drilling solution that offers a unique combination of high-quality via formation and high-accuracy, in a robust platform that delivers high-volume throughput at a competitive price point.
- HDI PCB Processing
- HDI Substrate Processing
For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.