Affordable versatility in CO2 laser via drilling for HDI applications.
Whether processing PCBs or substrate, MKS laser drilling systems enable PCB manufacturers to include rigid HDI processing services to their customers as part of a broader portfolio of services and at a lower cost of ownership while leveraging the experience of a laser systems provider that has a demonstrated history of applied laser expertise.
HIGH DENSITY INTERCONNECT PLATFORMS
CO2 Via Drilling For FCBGA(ABF) IC Substrate Manufacturing
The industry’s most Innovative CO2 via drilling system powered by quasi-continous wave laser and AOD technology for maximum performance.
- Advanced HDI PCB
- IC Packaging
- IC Substrate
- Non Cu-Clad Dielectric
CO2 via drilling for HDI PCB manufacturing.
Take advantage of a powerful new CO2 laser and a new set of control capabilities that leverage ESI’s decades of laser-material interaction experience and application expertise to help you innovate and stay ahead.
GeodeTM is ESI’s most advanced HDI microvia drilling solution for precision processing of a wide range of applications. Geode’s compact and lightweight system architecture allows for more flexibility in system placement and use on production floor.
- PCB Manufacturing
- Integrated circuit packaging
- Substrate processing
- System level packaging
For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.