Precision through hole via drilling with proven ESI technology.


Precision through hole via drilling with proven ESI technology.

ESI’s flex drilling systems process quality through vias with high productivity and excellent cost of ownership. With its broad portfolio of systems, ESI offers unparalleled choice to find the best system for your needs.

Take advantage of ESI’s purpose-designed lasers to improve your process quality. Drill with ESI systems field-proven for accuracy, reliability, and speed at the world’s leading flex PCB manufacturers. Process through via holes as small as 20um with excellent roundness and taper in a variety of materials. Avoid heat-affected zone (HAZ), minimize carbonization, improve circularity, and increase productivity in small and large vias using ESI’s patented Third Dynamics™ beam positioning.

ESI has the technology and experience to help optimize your production line.

Materials

  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesive-less copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Other unclad flex circuit materials

THROUGH HOLE VIA DRILLING PRODUCTS


RedStone Flex PCB Laser Processing System

RedStone delivers a robust solution to through via and routing applications for a wide variety of flex manufacturing needs. With the same accuracy, sturdy frame, and software functionalities as ESI’s other flex drilling systems, RedStone offers an ideal entry point for customers new to flex drilling.

learn more about RedStone

APPLICATIONS:
  • Flex and interconnect processing
  • Blind via drilling (BHV)
  • Through via drilling (THV)
  • Routing
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

High quality and high speed that translates to breakthrough productivity.

The CapStone™ system incorporates new laser technology and new laser control capabilities to deliver a high-throughput solution. CapStone addresses an evolving set of production challenges faced by leading FPC processors to enable higher levels of precision–even on thinner materials.

learn more about CapStone

APPLICATIONS:
  • Blind via drilling (BHV)
  • Through via drilling (THV)
  • Routing
  • Patterning
  • Skiving
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid crystal polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT duroid)
  • Coverlay (polyimide + adhesive)

The 5335 is able to handle the finest materials with optimal production speeds and quality.

The 5335 is a perfect flex PCB laser processing solution for leading-edge flex circuit manufacturing customers. Now in service at the top 10 flex PCB manufacturing companies, the 5335 laser via drilling machine is a good fit for customers requiring production-oriented flex PCB via drilling for PCB laser processing. It is also a good fit for general micromachining customers looking to take advantage of the state-of-the-art laser processing technology and applied laser expertise built into the 5335 platform.

learn more about 5335

APPLICATIONS:
  • Blind via drilling (BHV)
  • Through via drilling (THV)
  • Routing
  • Patterning
  • Skiving
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

See what it's like to be an ESI customer - contact an ESI Sales Expert today