Improve your routing accuracy and minimize heat-affected zones.


Precision routing with proven ESI UV laser technology.

Choose from the ESI flex processing system portfolio to optimize around your routing requirements. Various laser options and levels of system capabilities allow you to find the right balance between cost and quality.

With increasing flex circuit design complexity, shrinking circuit sizes, and increasing pace of development, many PCB processors are shifting from mechanical routing and punching processes to laser routing processes. Not only do laser processes allow for more intricate patterns to be processed, but also do so with zero mechanical stress and high accuracy.

Rout materials ranging from coverlay, flex circuits, and even thin (<500um) glass-reinforced circuits with minimal carbonization and high productivity.

Materials

  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesive-less copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)
  • Other unclad flex circuit materials

ROUTING PRODUCTS


LodeStone Laser Processing System

The LodeStone system is a more accurate and flexible processing alternative for the efficient cutting and drilling of flexible materials. Its short pulse-width femtosecond laser results in low levels of carbonization and minimal heat affected zones, delivering the exceptional accuracy and tight tolerances required by processors driving new solutions to market.

learn more about LodeStone

APPLICATIONS:
  • Flex and interconnect processing
  • FPC depaneling
  • Coverlay routing
  • Touchscreen and polarizer cutting
  • Through via drilling (THV)
MATERIALS:
  • Polyimide (PI)
  • Liquid Crystal Polymer (LCP)
  • Cyclo-Olefin Polymer (COP)
  • Polyethylene terephthalate (PET)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

RedStone Flex PCB Laser Processing System

RedStone delivers a robust solution to through via and routing applications for a wide variety of flex manufacturing needs. With the same accuracy, sturdy frame, and software functionalities as ESI’s other flex drilling systems, RedStone offers an ideal entry point for customers new to flex drilling.

learn more about RedStone

APPLICATIONS:
  • Flex and interconnect processing
  • Blind via drilling (BHV)
  • Through via drilling (THV)
  • Routing
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

High quality and high speed that translates to breakthrough productivity.

The CapStone™ system incorporates new laser technology and new laser control capabilities to deliver a high-throughput solution. CapStone addresses an evolving set of production challenges faced by leading FPC processors to enable higher levels of precision–even on thinner materials.

learn more about CapStone

APPLICATIONS:
  • Blind via drilling (BHV)
  • Through via drilling (THV)
  • Routing
  • Patterning
  • Skiving
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid crystal polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT duroid)
  • Coverlay (polyimide + adhesive)

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

See what it's like to be an ESI customer - contact an ESI Sales Expert today