Go with the recognized leader in flex PCB laser processing solutions.

ESI Flex PCB machines future-proof your production line with a broad spectrum of applications capability.


Flex PCB laser processing

Applications versatility and high productivity combine to deliver high quality and high yields.

ESI takes great pride in our over 20 years of experience in the development of laser systems and applications for the flex circuit industry. Our portfolio of systems has been developed to enable all types of manufacturers to select the tool that is right for them.  

Whether your goal is to achieve the highest throughput, to enable the highest quality at a high-mix/low-volume PCB shop serving a broad range of military, medical, and prototype consumer electronics markets, or to just get the job done at a low entry price point for a flex PCB shop that is just getting started with laser processing, ESI’s flex portfolio excels at satisfying each of these unique needs with a low total cost of ownership.

With a comprehensive selection of laser options, proprietary beam positioning capabilities that lead the industry and exclusive power control technology that helps increase your yields, the systems in ESI’s flex systems portfolio allow a wide range of materials to be processed accurately and with high resolution. We work with you to understand your unique needs and help you succeed in winning orders and keeping your customers happy through excellent applications and service support.

FLEX INTERCONNECT PRODUCTS


GemStone is the elite flex PCB laser with increased via performance and accuracy.

GemStone is designed to provide leading-edge PCB manufacturers with a high-throughput solution for efficiently processing flexible circuit interconnects on thinner and lighter materials. This enables flex PCB processors to extend their services and cost-effectively address the broader set of market requirements associated with high-volume flex processing.

learn more about GemStone

APPLICATIONS:
  • Blind via drilling (BHV)
  • Through via drilling (THV)
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Coverlay (Polyimide + Adhesive)

The 5335 is able to handle the finest materials with optimal production speeds and quality.

The 5335 is a perfect flex PCB laser processing solution for leading-edge flex circuit manufacturing customers. Now in service at the top 10 flex PCB manufacturing companies, the 5335 laser via drilling machine is a good fit for customers requiring production-oriented flex PCB via drilling for PCB laser processing. It is also a good fit for general micromachining customers looking to take advantage of the state-of-the-art laser processing technology and applied laser expertise built into the 5335 platform.

 

learn more about 5335

APPLICATIONS:
  • Blind via drilling (BHV)
  • Through via drilling (THV)
  • Routing
  • Patterning
  • Skiving
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

The Flex5335 processes the thinnest flex materials with high precision.

The Flex5335 shares technology and application advantages with the rest of the 5335 family of FPC laser processing systems. It differentiates itself by incorporating proven UV laser technology with the versatility of beam shaping technology to allow manufacturers to more precisely and efficiently process unclad organic materials.

learn more about Flex5335

APPLICATIONS:
  • Coverlay routing
  • Solder-mask opening
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Coverlay (Polyimide + Adhesive)
  • Other unclad flex circuit materials
  • Solder mask

Model 5335xi processes via drilling for most flex and rigid-flex PCB needs.

The 5335xi has a low cost of ownership and addresses most flex and rigid-flex PCB processing needs.  The 5335xi also has the diode pumped, repetitively Q-switched solid state laser which provides high productivity with excellent vias.

Some of the 5335xi highlights are:

  • ESI’s fourth-generation beam positioner.
  • Peak point-to-point move speed is 2,000 points per second.
  • 18,000 vias per minute.
  • Vias as small as 25 microns.

learn more about the 5335xi

APPLICATIONS:
  • Blind via drilling (BHV)
  • Through via drilling (THV)
  • Routing
  • Patterning
  • Skiving
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

LodeStone Laser Processing System

The LodeStone system is a more accurate and flexible processing alternative for the efficient cutting and drilling of flexible materials. Its short pulse-width femtosecond laser results in low levels of carbonization and minimal heat affected zones, delivering the exceptional accuracy and tight tolerances required by processors driving new solutions to market.

learn more about LodeStone

APPLICATIONS:
  • Flex and interconnect processing
  • FPC depaneling
  • Coverlay routing
  • Touchscreen and polarizer cutting
  • Through via drilling (THV)
MATERIALS:
  • Polyimide (PI)
  • Liquid Crystal Polymer (LCP)
  • Cyclo-Olefin Polymer (COP)
  • Polyethylene terephthalate (PET)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

RedStone Flex PCB Laser Processing System

RedStone delivers a robust solution to through via and routing applications for a wide variety of flex manufacturing needs. With the same accuracy, sturdy frame, and software functionalities as ESI’s other flex drilling systems, RedStone offers an ideal entry point for customers new to flex drilling.

learn more about RedStone

APPLICATIONS:
  • Flex and interconnect processing
  • Through via drilling (THV)
  • Routing
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

The connected world requires new tools, manufacturing rules and innovation to stay ahead. Synthesis provides news, resources, and insights to help you lead the way.

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For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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