Choose the recognized leader.

Deploy ESI’s proven via drilling technology.


High yield and high throughput for blind vias on even the thinnest flex laminates.

With over 20 years of experience in building systems and developing processes for these applications, ESI is the world leader in blind via drilling solutions for the FPCB industry.

When choosing ESI tools, you gain access to technology and techniques that make processing these notoriously-difficult applications easy. Take advantage of patented methods of processing blind vias, pioneered by ESI in the early days of flex PCB drilling. Develop efficient, high-quality and high-yield processes using ESI’s easy-to-use process development software. Use ESI’s pulse-level, real-time digital power control to ensure high quality and high yield – never damaging the bottom conductive layer.

ESI’s world-class applications engineering team will help optimize productivity, yield, accuracy, via circularity, etchback, bottom conductive layer damage, taper, and other factors to provide you with the best solution to your unique set of requirements.

  • Adhesive-less copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • 5G materials such as LCP, modified PI, and low-Dk adhesives
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)

BLIND VIA DRILLING PRODUCTS


CapStone’s new-generation laser technology and control capabilities to deliver high-quality blind via processing at breakthrough productivity.

CapStone is designed to provide leading-edge PCB manufacturers with a high-throughput solution for drilling high-quality blind and through vias. Incorporating a combination of new laser technology, fluence control and beam positioning, CapStone delivers the fastest blind via processing times in the industry. Now FPC processors can process a wider range of materials at high yields and high productivity with minimum process development and maximum uptime.

 

learn more about CapStone

APPLICATIONS:
  • Blind via drilling (BHV)
  • Through via drilling (THV)
  • Routing
  • Patterning
  • Skiving
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid crystal polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT duroid)
  • Coverlay (polyimide + adhesive)

The 5335 is able to handle the finest materials with optimal production speeds and quality.

The 5335 is a perfect flex PCB laser processing solution for leading-edge flex circuit manufacturing customers. Now in service at the top 10 flex PCB manufacturing companies, the 5335 laser via drilling machine is a good fit for customers requiring production-oriented flex PCB via drilling for PCB laser processing. It is also a good fit for general micromachining customers looking to take advantage of the state-of-the-art laser processing technology and applied laser expertise built into the 5335 platform.

learn more about 5335

APPLICATIONS:
  • Blind via drilling (BHV)
  • Through via drilling (THV)
  • Routing
  • Patterning
  • Skiving
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

RedStone Flex PCB Laser Processing System

RedStone delivers a robust solution to through via and routing applications for a wide variety of flex manufacturing needs. With the same accuracy, sturdy frame, and software functionalities as ESI’s other flex drilling systems, RedStone offers an ideal entry point for customers new to flex drilling.

learn more about RedStone

APPLICATIONS:
  • Flex and interconnect processing
  • Blind via drilling (BHV)
  • Through via drilling (THV)
  • Routing
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

See what it's like to be an ESI customer - contact an ESI Sales Expert today