High-volume passive component manufacturing solutions from the market leader.
ESI delivers laser tools and other systems that facilitate the manufacture of passive components including test and measurement, CircuitTrim® solutions for precision thin film Chip-R and thick film Chip-R laser trimming, chip inspection, as well as associated replacement tooling, carrier plates and belts.
High throughput and reliability to cost-effective manufacturing.
Miniature multi-layer ceramic passive (MLCP) components are used in volume in nearly all types of electronic circuitry. ESI offers automated test, termination, high-speed handling and visual inspection equipment with the high throughput and reliability needed to enable cost-effective manufacturing of MLCPs and other components, such as arrays, inductors and varistors.
ESI CircuitTrim® systems for both thick and thin film are the most flexible laser processing solutions available. These laser-based systems precisely adjust the parameters of individual components by removing exact amounts of material.
Wafer Trimming Applications
An advanced platform for high precision, high throughput wafer-level optimization of linear and mixed signal IC devices. The M350 is the next generation of ESI’s WaferTrim™ technology. It includes a fully integrated state-of-the-art Laser Trimmer and Wafer Prober system with Advanced vision and motion subsystems that provide dramatically improved positioning and alignment capability.
MLCC Testing Applications
ESI’s MLCC testing solutions deliver the throughput that high-volume MLCC manufacturing requires. Our patented rotary handling technology ensures minimal damage to components as the result of testing, even at throughput rates of 20,000 components per minute.
For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.