The 5335: History of a revolutionary product.
Click the links below to explore the ESI innovations helping to fuel significant technology advancements.
First UV flex processing system, available with roll handling and arc-pump laser, XY stage beam positioning with productivity of one via per second
Introduced patented beam positioning technology with coordinated motion of stage and galvanometer for highest productivity
Integrated first DPSS laser, evolved from arc lamp predecessors, for significantly higher reliability
Improved reliability and flexibility through innovative optics design
Released "top hat" imaged beam configuration with variable spot size for best performance in unclad materials
First Flex system with hundreds of units sold. Improved productivity and flexibility through increased laser power and improved beam positioning
Incorporated digital galvo technology into the 5330 for increased throughput and accuracy
Integrated improved laser power and beam positioning for higher throughput, integrating the same laser as the 5335 would eventually leverage.
General purpose production-oriented flex circuit via drilling system evolved from 5330xi, with improved productivity and precision through Third Dynamics™ beam positioning.
Entry-level flex circuit via routing and drilling system.
Revolutionary flex circuit via drilling system with 2X productivity and improved process and system robustness
Find out why the ESI family of laser processing systems leads the market in Flex PCB.
It’s no coincidence that the world’s top flexible circuit manufacturers trust ESI with their production. Our market leadership in via drilling is driven by a focus on providing quality, reliability and low cost-of-ownership that extends across the entire via drilling systems portfolio. Regardless of the application; from the most simple coverlay cutting to advanced microvia drilling for HDI processing, ESI is the clear industry choice.
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