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Model 9820
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ESI’s Model 9820 Laser Processing System is the latest generation system based on ESI’s successful 9800 platform. The 9820 is designed to meet the needs of high volume 300 mm wafer processing of DRAM, SRAM, embedded memory and other laser fuse applications. The requirements of new generations of high-speed chips are driving the industry towards tighter link pitches and new fuse materials. The 9820 offers the widest process window, and the smallest spot sizes on these new devices.
For more information on this product contact Ian Guiney at guineyi@esi.com.
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