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Model 4340
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Please contact ESI headquarters for information.
The ESI Model 4340 Laser Trimming System, featuring ESI's patented 1.3 micron wavelength process, offers greater throughput for trimming and fine-tuning of thick-film hybrid and surface-mount devices. The patented 1.3 micron wavelength diode-pumped laser process reduces or eliminates laser-induced optoelectric response and improves the "trimmability" of most circuits. The reduced optoelectric effects increase system output and allow trimming to much tighter tolerances without compromise.
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