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Model 5650
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ESI's state-of-the-art ICP5650 dual head UV laser system is the premier choice for drilling very high quality blind vias in electronic packages. The model ICP5650 incorporates a single high power diode pumped laser with high repetition rates of up to 70kHz. The ICP5650 is:
- Is specifically designed for IC packaging market
- Has a high-speed beam positioning system with GVDTM
- Delivers 2500 pps performance for reduced move time between vias
- Contains 7 axes with coordinated motion control
For more information please contact Jeff Albelo at albeloj@esi.com
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