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The 9835UV is based on the successful 9830 platform, which was developed specifically to meet the needs of 0.09 micron and smaller design rules on DRAM, SRAM, embedded memory and other laser fuse applications.
The system is able to process tight link pitches on new fuse materials. The large-field 98XX platform minimizes alignment, stepping and other overhead factors that impact throughput, while auto-adjusting optics keep optical components perfectly aligned for optimal process performance and highest productivity.
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