The Model 9830 is based on ESI’s highly successful 98XX platform, which was developed specifically for advanced DRAM, SRAM, embedded memory and other laser fuse applications.

The 9830 offers a wide process window, and small spot sizes to address the requirements of 300mm wafer processing.

The 9830 is geared toward processing tight pitch metal fuses on 90nm semiconductor devices and is optimized for high throughput production environments.  

• Capable of processing tight pitch metal fuses on 90 nm semiconductor devices

• Designed for high throughput

• Automated 300 mm production

• Enhanced Beam-Positioning Technology