Model 9820, Laser Link-Processing System

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The Model 9820 is the latest generation system based on ESI's sucessful 98xx platform.  The 9820 is designed to meet the needs of high volume 300 mm wafer processing of DRAM, SRAM, embedded memory and other laser fuse applications.

The requirements of new generations of high-speed chips are driving the industry towards tighter link pitches and new fuse materials. The 9820 offers the widest process window, and the smallest spot sizes on these new devices.

  • Capable of processing new generations of tight pitch fuses

  • Designed for high volume, automated 300 mm production

  • Wide range of processing applications - Poly Si, Al, and Cu capable

  • New high-performance laser option