Laser Fuse Processing

ESI is pushing boundaries with semiconductor laser fuse processing. With state-of-the-art laser positioning, ESI's world-class production systems use precise laser energy to boost yields in the production of next-generation devices for DRAM, SRAM, embedded memory and other laser-fuse applications.

The result: repair costs below one half of one percent of overall die costs, the ability to shrink die geometries, and an up-to-100% increase in the number of functional devices on each wafer.

Look to ESI to deliver ultra-small spot size, ultra-throughput and ultra-yields.


Model 9850TPIR+, Dual-Beam, Tailored-Pulse Laser Link-Processing System The Model 9850TP is designed to meet the needs of an ample variety of DRAM, FLASH and embedded memory devices.