Ground Breaking Results Laser Applications

ESI's PyroFlex™ flexible laser platform opens up new avenues for laser processing with its unprecedented control over pulse shape. Moreover, its broad operating range makes it suitable for a wide variety of processes. No longer is it necessary to devote time, effort and expense to identify a suitable laser every time you have a new process to develop – the PyroFlex™ is waiting to be dialed-in to meet all of your process needs. And the PyroFlex™ is not just a pretty lab tool. It is production-ready, designed for deployment directly into your mission-critical 24/7 process.

Here is a sample of the many new processes serving the Solar Cell market which have come through our Applications Laboratories during the last 12 months. All of these processes has been addressed using the same standard PyroFlex™ flexible laser platform. In almost every case our results have demonstrated significant – and sometimes groundbreaking – improvements over the existing state-of-the-art. We have demonstrated processes previously thought not to be possible without resorting to expensive and temperamental ultrafast lasers. From short ns-range pulses to pulses 100’s of ns long, from single, double, and multiple pulses to custom shaped pulses, the flexible PyroFlex™ can be programmed to optimize your process.

Applications

PyroPhotonics has for the first time demonstrated effective, high-quality laser scribing of CIGS (Copper Indium Gallium diSelenide) materials using our programmable PyroFlex™-25 flexible pulsed laser. Our patent-pending process produces clean scribes with no melting of the CIGS at the sidewalls, and leaves the Mo substrate undamaged.

PyroPhotonics has demonstrated effective, high-quality Laser Fired Contacts (LFC) using our programmable PyroFlex™-25 flexible pulsed laser. By fully exploiting the pulse-shaping capabilities of the PyroFlex™-25 we have enabled our customers to develop significant improvements in their understanding of this critical process.

The PyroFlex™-25 laser drills 6,200 holes per second in 220µm Silicon wafers with only 20W of average power. This is 50% more throughput than Q-switched drilling lasers with 60-100W of average power.

PyroPhotonics has demonstrated effective, high-quality laser scribing of ZnO on Glass materials using our programmable PyroFlex™-25 flexible pulsed laser. Our patent-pending process produces clean scribes without cracking of either the ZnO edges or the underlying glass substrate.