The Model Si5330 is a heavy-duty solution optimized for precision high-aspect-ratio controlled-depth and through vias in silicon.

• The system is an extension of the 5300 family of tools, of which hundreds are deployed globally.

• The si5330  micromachining system employs a high-power UV laser capable of rapidly drilling and routing in most semiconductors.

• Via drill rates of up to 2000 via per second are achievable, depending on the material’s thickness and via size.