The Model Flex5330 laser micromachining system is optimized for via drilling and profiling on flexible circuits, and rigid-flexible printed circuit boards (PCBs).

• The model Flex5330 incorporates a high-power diode-pumped laser with pulse repetition frequency of up to 70kHz.

• The optical system is designed to support the various optical configurations required to meet the needs of the Flex industry.

• Via drill rates of up to 15,000 vias per minute are typical for copper-clad material constructions.

• The combination of a high-power, high-pulse frequency laser with a high-speed Beam Positioner enables the system to cut copper clad dielectrics with excellent quality and high productivity.