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The Model 5330xi laser processing system is the successor to the Flex 5330, the most popular UV laser processing system in industry history.
Further optimized for via drilling and profiling on flexible circuits, and rigid-flexible printed circuit boards (PCBs).
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Via drill rates of up to 15,000 vias per minute are typical for copper-clad material constructions.
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The combination of a high-power, high-pulse frequency laser with a high-speed Beam Positioner enables the system to cut copper clad dielectrics with excellent quality and high productivity.
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